Celestica DS6005 Puts 102.4Tbps of Co-Packaged Optics and 64 1.6TbE Ports in a 1.5OU Liquid-Cooled ORv3 Switch
Celestica introduced the DS6005 at the OCP Global Summit, a co-packaged optics (CPO) data center switch that puts 102.4Tbps of switching capacity and 64 optically enabled 1.6TbE ports in a 1.5OU, fully liquid-cooled chassis for Open Rack v3. It is built on Broadcom’s Tomahawk 6 Davisson, the CPO version of the 102.4T Tomahawk 6, which The post Celestica DS6005 Puts 102.4Tbps of Co-Package…
Celestica's DS6005 pairs Broadcom's Tomahawk 6 Davisson CPO silicon with 64 1.6TbE ports in a liquid-cooled, 1.5OU ORv3 chassis, pointing to AI fabrics where network bandwidth scales as fast as the compute it connects. As the fabric gets faster, the pressure moves to the memory behind each node: HBM on accelerators and high-capacity DDR5 RDIMM or MRDIMM on host servers must keep GPUs and CPUs fed rather than leave them stalled. Liquid-cooled, high-density ORv3 designs also suggest memory configurations will be planned alongside rack-level power and thermal limits, not after them. If you're sizing memory for a next-generation AI cluster, check live inventory or request a quote on the DDR5 and HBM-adjacent modules your build calls for.